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in SMD design type according to DIN EN IEC 60751
| Brand | JUMO |
| Sku | 906142 |
| Areas of application | Surface and ambient temperature measurements on circuit boards (e.g. in temperature probes, temperature monitoring or compensation circuits) |
| Connection | Gold-plated nickel solder contact, thickness of nickel layer ≥ 1 µm, gold ≥ 40 nm, solderability according to IEC / DIN EN 60068-2-58 |
| Temperature range | -70 to +250 °C |
| Design type | SMDFC-L-AuNi |
| Standard | DIN EN IEC 60751 |
| Temperature coefficient | α = 3.850 × 10-3 °C-1 (between 0 and 100 °C) |
| Advantages | For automatic placement, SMD size 0805, single side contact for "face down mounting" (flip chip), AEC-Q200 for selected sensors, gold plated nickel solder contact, high-purity and even contact layer for better solder connection, high measuring accuracy, high long-term stability, standardized nominal values and tolerances, fast response behavior |
| Processing | Reflow soldering |
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